Challenges
The system needed to assemble thermal SMD fuses while monitoring all joining steps, laser-marking the housing, performing a soldering process, and completing an electrical end test (current and resistance measurement). All steps required high repeatability and stable inline quality control. The system also had to separate IO and NIO parts and package the approved fuses into blister tape.
Our Solution
A rotary indexing assembly machine with sixteen dual fixtures executes the full assembly sequence. Five feeding systems supply the components. The spring characteristic of the integrated release spring is measured during assembly. Two dosing stations apply solder paste, and all joining processes are camera-monitored and force-controlled. Laser marking is performed on the housing, followed by verification via camera system. A pre-flow oven activates the solder paste. Final electrical testing determines IO / NIO selection, after which conforming fuses are packaged into blister tape.
Special Features
The system combines assembly, laser marking, process monitoring, and electrical testing within a continuous rotary indexing concept. Controlled joining processes and integrated measurement technology ensure high quality and reproducibility. Thanks to its modular design principle, the solution can be adapted for additional fuse types.
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